depaneling vs shearing

Dear Colleagues: I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, I need data not opinions. Thanks in advance for your help. Sincerely, B. Decker

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| Dear Colleagues: | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | I need data not opinions. | Thanks in advance for your help. | Sincerely, | B. Decker B. Decker, Exactly what data is it that you need? The effects on the laminate? The effects either method has on through-put? The effects that each method has on bare board costs? The effect either method has on panel layout/design? Or do you want pros and cons of each method? If that is the case, then you're going to get opinions. What one man thinks is a piece of cake might be the next mans nightmare... be more specific with your request and you'll probably get some useful information. -Steve Gregory-

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| | | Dear Colleagues: | | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | | I need data not opinions. | | Thanks in advance for your help. | | Sincerely, | | B. Decker | B. Decker, | Exactly what data is it that you need? The effects on the laminate? The effects either method has on through-put? The effects that each method has on bare board costs? The effect either method has on panel layout/design? Or do you want pros and cons of each method? If that is the case, then you're going to get opinions. What one man thinks is a piece of cake might be the next mans nightmare... be more specific with your request and you'll probably get some useful information. | -Steve Gregory- Steve: Thank you for your input. I am looking for info on the impact depaneling or shearing has on the yields, and stress, strain or damage to the components or solder joints. That type of data. Thanks BD

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| Dear Colleagues: Most responses will be individual involvements with either rotors or the old pizza type cutters. Depending upon how your multi-up boards are designed will determine the actual spacing that you have for the singulation process. (rotors require more clearance spacing between boards). I for one feel that the rotor approach is the best one for most applications as the multiple up board construction is better that the boards designed for shearing. (for one thing the board won't have as much sagging when going through wave solder) There are several companies that manufacture depaneling systems: Depaneling systems rotors: Cencorp http://www.cencorp.com Ozo Corp http://www.depanelozo.com cutters: Cabtech htto://www.cabgmbh.com Might take a look at these websites and contact them about information on their systems. Wayne

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| | | | | | Dear Colleagues: | | | I am looking for quantiative data on comparing the effects of depaneling/routing versus other forms of singulation specifically shearing, | | | I need data not opinions. | | | Thanks in advance for your help. | | | Sincerely, | | | B. Decker | | B. Decker, | | Exactly what data is it that you need? The effects on the laminate? The effects either method has on through-put? The effects that each method has on bare board costs? The effect either method has on panel layout/design? Or do you want pros and cons of each method? If that is the case, then you're going to get opinions. What one man thinks is a piece of cake might be the next mans nightmare... be more specific with your request and you'll probably get some useful information. | | -Steve Gregory- | Steve: | Thank you for your input. I am looking for info on the impact depaneling or shearing has on the yields, and stress, strain or damage to the components or solder joints. That type of data. | Thanks | BD Dear BD, Did you get some data you were looking for. I will like to share it. Please forward it to my email if you are successful. Generally you get vague opinions only. ZULFI

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