Solid Solder Deposits

Howdy all- Does anybody have any experience with solid solder deposits as an alternative to paste deposits? I have heard many good things, but do board fabricators have the technology to do this? Where can I get more information on how to try this technology out? Ryan Jennens Phoenix Engineering

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| Howdy all- | Does anybody have any experience with solid solder deposits as an alternative | to paste deposits? I have heard many good things, but do board fabricators have | the technology to do this? Where can I get more information on how to try this | technology out? | Ryan Jennens | Phoenix Engineering Ryan: Two alternatives to overcoming perceived limitations of placing fine pitch components on HASL boards are: 1 West goes East: Roughly conventional board fab process. Placing components on printed paste on alternate finishes (ie, OSP, Ag/Ni, Au flash) on copper pads 2 East goes West: Completely different board fab process. Placing components on a flux on solder coated copper pads, where the solder on the pads have been finished differently than HASL Certainly alternative 1 West goes East has greater acceptance than the other alternative. The technologies you are talking about are proprietary. So you need to find licensees from the folks below. 1 Optipad SMW Electronik Miltec 404.662.5922 John Gregory Colonial Ckts 2 Sipad Siemens 3 Precision Pad Technology Santa Ana CA 714.557.3383 Dave F

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Ryan - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach using laser micro features. The process uses laser ablated surface features which thermally manage the reflow characteristics of very fine solder deposits, we call the technology MicroBump. MicroBump transitions solder spheres from the component to the substrate and is the antithesis of C4 ideology. If you are still interested drop me a note and I'll send more info. By the end of the year we will have a domain committed to the integration of silicon & substrates using laser micro features

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Dave - I noticed your comment concerning solid solder and was compeled to drop a note. We have developed a process which uses some material characteristics from earlier efforts with this technology and profiled it for flip chip and area array attach using laser micro features. The process uses laser ablated surface features which thermally manage the reflow characteristics of very fine solder deposits, we call the technology MicroBump. MicroBump transitions solder spheres from the component to the substrate and is the antithesis of C4 ideology. If you are still interested drop me a note and I'll send more info. By the end of the year we will have a domain committed to the integration of silicon & substrates using laser micro features

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