Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Micro-BGA Process

Richard Scarcelli

#14578

Micro-BGA Process | 25 August, 1998

Would like to know the following information on processing micro bga's: 1) Fine mesh solder paste .vs. tacky flux --- which is best 2) Stencil thickness for solder screen 3) Aperature size for standard pitch balls 4) Which direction is the market going to, a solid solder ball or a thin nickel coated ball. 5) Name brands of flux and solder used for this process Would appreciate any thoughts or comments!!!

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Richard Scarcelli

#14580

Still Need Info | 27 August, 1998

| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is the market going to, a solid | solder ball or a thin nickel coated ball. | 5) Name brands of flux and solder used for this process | Would appreciate any thoughts or comments!!!

Still looking for info.....

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Earl Moon

#14581

Re: Still Need Info | 28 August, 1998

| | | Would like to know the following information on processing micro bga's: | | 1) Fine mesh solder paste .vs. tacky flux --- which is best | | 2) Stencil thickness for solder screen | | 3) Aperature size for standard pitch balls | | 4) Which direction is the market going to, a solid | | solder ball or a thin nickel coated ball. | | 5) Name brands of flux and solder used for this process | | Would appreciate any thoughts or comments!!! | | Still looking for info..... Have you addressed the principles at Tessera about their latest? Verne Solberg and Joe Felstad would be good folks to start with. Also, check the IPC Technet for their latest. Earl Moon

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Javier Carrera

#14579

Re: Micro-BGA Process | 11 September, 1998

| Would like to know the following information on processing micro bga's: | 1) Fine mesh solder paste .vs. tacky flux --- which is best | 2) Stencil thickness for solder screen | 3) Aperature size for standard pitch balls | 4) Which direction is the market going to, a solid | solder ball or a thin nickel coated ball. | 5) Name brands of flux and solder used for this process | Would appreciate any thoughts or comments!!!

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