Dicing Operation

Hello everybody

This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry.

I need information about the following:

1.0 The dicing technique. 2.0 The placement of the dice from the wafers to the waffle pack 2.1 What kind of placement equipments and pick up tips are used for this purpose. 2.1 Would the pick up tip cause damage to the dice. (Either top side or back side damage) 3.0 The different inspection techniques available in industry in order to reduce this damage. I would really want to learn about the process and the product monitors used in order to assure good and defect free product.

Any help would be greatly appreciated.

Regards Manish

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| Hello everybody | | This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. | | I need information about the following: | | 1.0 The dicing technique. | 2.0 The placement of the dice from the wafers to the waffle pack

Contact Silrec out in San Jose on 815-784-7360 or look them up on the internet. They have made dummy wafers for me and should be able to answer your questions on dicing. Also contact Laurier in Manchester, NH on 603-626-4700. They make equipment for the picking of IC chips from wafers. They have also made die picking equipment for use on my equipment.

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I will try to answer some of your questions. My name is Ron Gilman and I am President of Chipscale Robotics here in Fremont California. We manufacture Die Pick & Place equipment and would be happy to send you brochures. Please email me with your address. Now, to answer your questions ( the ones that I can): 2.0 There are manual, semi auto, and full automatic Die pick & place systems available in the industry. It depends on your requirements and budget. 2.1 Pick up tips and plunge up needle(s) are available from several sources. Damage to the die can occur with older design equipment. Newer system have software control built into the design that prevents damage. 2.2 The normal inspection is for ink dot and major chips and scratches. We can also inspect for bump, mark, and OCR. If I can help further please let me know. Regards, Ron Gilman

| Hello everybody | | This is kind of urgent for me. I would appreciate if anyone of you could tell me where could i find information about the different dicing techniques and operations used in the industry. | | I need information about the following: | | 1.0 The dicing technique. | 2.0 The placement of the dice from the wafers to the waffle pack | 2.1 What kind of placement equipments and pick up tips are used for this purpose. | 2.1 Would the pick up tip cause damage to the dice. (Either top side or back side damage) | 3.0 The different inspection techniques available in industry in order to reduce this damage. | I would really want to learn about the process and the product monitors used in order to assure good and defect free product. | | Any help would be greatly appreciated. | | Regards | Manish |

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