fluxless AuSn solder bumping for flip-chip

Hi all, i'm researching information on fluxless solder bumping of flip-chip by either : 1. electroplating AuSn bumps 2. electroless Ni on Al pads in an autocatalysis process. could anyone point me in the direction of more information ? particularly, intermetallic diffisions, materials reactions etc.

TIA, Sidharth

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