| | | I am looking for a piece of equipement that can | safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap. | | | | | |
Ray:
There is a company in Woburn, MA called Midas Technologies that manufacturers a die removal system for hybrids, might be something to look at. The person to speak with is Ken Towl (781) 938-0069.
Wayne
ps if you call ken tell him I said hi
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