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Is there a threshold on ball size where we would not need to re-ball a BGA ( i.e. 8 ball / small type packages).

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#79242

Re-balling BGA's | 26 October, 2017

Is there a threshold on ball size where we would not need to re-ball a BGA ( i.e. 8 ball / small type packages).

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#79783

Re-balling BGA's | 14 February, 2018

do you mean you are seeing deviation in ball size prior to placement? if so i don't know of any spec that would cover this. however provided your ball is within 75% of the size of eachother and you are applying solder paste to the pads and not just tacky flux and place/reflow i would think you would be fine.

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