Lasers can be used to depanel individual PCBs from panels. In addition, laser depaneling is often used when very tight tolerances are required for PCBs such as when there is very little room in an enclosure that the board is fitting in to. But the challanges occur when damages and fractures to substrates and circuits occur due to mechanical stress. Can anyone have any solution to like this problems?
Use a router with fiducial correction? in reality if you are putting a PCB in a plastic enclosure then the injection moulding is going to have far greater tolerances than a laser or router depanelised PCB is. Also, if our laser markers are anything to go by then there will be dust. Lots of dust. Lots and lots of dust. And the smell of burning FR4. Also laser depanelisers aren't going to like it if you use metal PCBs.