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Au Wire bonding failure

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#76730

Au Wire bonding failure | 14 December, 2016

Hi all,

Recently, we are trying to do wire bonding between a 75 * 75 um pad on a chip and substrate with 150 um height difference, but when completing wire bonding and the wire bonds on pad and substrate, the pad will get out of the chip easily, so do you have ideas about the issue? and how to avoid it? We use 0.7 mil Au wire and the pad is plated with gold.

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#76732

Au Wire bonding failure | 14 December, 2016

As I understand, you are wire bond gold wire to gold pad, where the substrate has good bond strength, but the die does not.

If bond quality is good, and then drops off rapidly, then it's probably something to do with contamination within the system (check the plating etc)

Questions are: * What is the plating spec on the die? * Does the die meet the spec? * What is your acceptable lower pull strength? * What pull strength are you observing?

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#76748

Au Wire bonding failure | 16 December, 2016

> Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of the > chip easily, so do you have ideas about the > issue? and how to avoid it? We use 0.7 mil Au > wire and the pad is plated with gold.

> Hi all, > > Recently, we are trying to do > wire bonding between a 75 * 75 um pad on a chip > and substrate with 150 um height difference, but > when completing wire bonding and the wire bonds > on pad and substrate, the pad will get out of the > chip easily, so do you have ideas about the > issue? and how to avoid it? We use 0.7 mil Au > wire and the pad is plated with gold.

You might also consider bond cratering where the bonding force ruptures the underlying silicon, e.g. http://www.semlab.com/blog/?p=69 & http://www.semlab.com/blog/?p=191

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