N2 and Voiding??

Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significant from a practical standpoint. In other words, other factors were much more important in voiding and if you control those then the contribution of N2 really doesn't matter.

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