Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Difference Gold Plating electrolytic and ENIG with on BGA

Views: 6513

#64103

Difference Gold Plating electrolytic and ENIG with on BGA | 6 April, 2011

Hi, I am process engineer in PCBA factory.I have a question about gold plating on BGA.I want to know difference soldering performance between gold plating electrolytic and ENIG.Many thank for any idea.

reply »


aci

#64104

Difference Gold Plating electrolytic and ENIG with on BGA | 6 April, 2011

ENIG is the way you need to go. With ENIG you deposit a lot less gold. Too much gold will cause soler problems.

Matt www.americancircuits.com

reply »

#64107

Difference Gold Plating electrolytic and ENIG with on BGA | 7 April, 2011

I didn't know the difference for BGA. We found solderability probelm as show in attach.Then, we called to PCB maker and they said that it could be caused because of PCB finishing. Do you agree this probelm was happend because of PCB finishing? Unfortunately, the pCBs from pictures were made by same PCB house.

Attachments:

reply »


aci

#64111

Difference Gold Plating electrolytic and ENIG with on BGA | 7 April, 2011

First of all you need a new board house. You should quote us http://www.americancircuits.com. This really looks like a poor drilling operation with the blow holes. Blow holes are usually caused by two main problems. Improper drilling and/or moisture. These issues that I see would raise questions about the reliability of the produsts that you are shipping to your customer.

reply »

Conductive Adhesive & Non-Conductive Adhesive Dispensing

One stop service for all SMT and PCB needs