Dear Industry experts,
We have just developed a leadless, fluxless solder that can join various metals ) Al, Cu, brass, Steel, stainless and Titanium) and Ceramics ( Ruby, Quartz, Sapphires, glass, TiO2, etc)
We intend to explore electronics and RF applications for Al ( external radar antenna, replacing the need for gold plating.
Do you think there can be any market potential, supposing it pass all reliability tests?
Your opinions appreciated.
Yang
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