In AOI, 3D v.s. 2D imaging?

An ultimate truth in AOI is that "you can not avoid what you can not see". At the post solder stage, 2D inspection is typically not enough as it simply "can not see" everything using a single perspective, and therefore, can not detect all of the faults that may exist on the board including for example:

- J-leads which can not be seen by top view alone - Lifted lead, and lifted component that may hardly (if at all) be seen by top view

Using 3D AOI in the post-solder stage is a proven method for superior and comprehensive detection of all possible faults which includes classifying solder joints and judging their quality, detecting lifted leads and reporting co-planarity. Doing all this at high-speed without compromising inspection performance is also a tough challenge that advanced 3D AOI systems are able to handle.

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