PCB and component handling guidelines

Has anyone seen or put together a good collection of proper handling procedures for components and PCB's? I realize a lot of it is no-brainer stuff, but I need some depth for a training class we are putting together. This would include ESD, Moisture sensitive parts, parts sensitive to mechanical shock (i.e. crystals), parts with leads easily bent (QFP's. TSOP's), handling / packaging for bare and assembled boards, etc. I lot of this I am familiar with, but it would be great if there was a good collection of "best practices" out there to refer to.

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