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QFN Rework

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We are trying to benchmark processes being used for QFN rewo... - Jul 30, 2010 by reworkexchange  


reworkexchange

#62341

QFN Rework | 30 July, 2010

We are trying to benchmark processes being used for QFN rework and have broken them down in to:

1. Devices with outline package sizes 2. Devices with outline package sizes >= 3 x 3mm http://www.solder.net/stencilmate.asp

Inputs would be appreciated!

BWET

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