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Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA Solderability Issue

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#60464

BGA Solderability Issue | 17 November, 2009

Hi All Plz help , we are manufacturer of Set Top Boxes , where we use ST BGA 5202 ,Paste : ALPHA METAL OM338-T45-LF & STENCIL : 4 MIL & we also tried 5 mil . Problem : At first Test BGA work fine but after some days Assembly dead functional and when we press BGA by thumb it works. We also did Cross Sectional Analysis , there is no voids , no solder joints crack.

Plz help me to solve this issue.

E-mail : smtschool@gmail.com

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#60481

BGA Solderability Issue | 19 November, 2009

Check your profile, it might not have collapsed completely.

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#60498

BGA Solderability Issue | 19 November, 2009

Something is incorrect. Either: * Assembly dead functional and when we press BGA by thumb it works ... OR * Cross section with no voids , no solder joint crack.

Turn-off the smoke machine.

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#60501

BGA Solderability Issue | 20 November, 2009

what smoke machine?

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#60551

BGA Solderability Issue | 24 November, 2009

Its not been reflowed correctly. probably both heat too low and not long enough check your profile. cheers Greg

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#60618

BGA Solderability Issue | 6 December, 2009

Attached is the BGA BALL soldered underneath reflow profile , plz check and advice.

Attachments:

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Solder Paste Dispensing

Jade Series Selective Soldering Machines