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Date:
November 04, 2009 12:20 AM
Author:
Martin
Subject: suggest whether we can place BGA without Bals on PCB after Print
BGA Rework.
Pls suggest whether we can place BGA without Balls on PCB after Printing.
i.e without reballing if we mount BGA on PCB after Screen printing
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=60294)
Date:
November 04, 2009 05:18 PM
Author:
davef
Subject: suggest whether we can place BGA without Bals on PCB after Print
It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball.
There are:
* Reballing service providers
* Reballing preforms
* Forms that provide for the placement and soldering of loose solder balls.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=60316)
Date:
November 05, 2009 12:35 PM
Author:
Martin
Subject: suggest whether we can place BGA without Bals on PCB after Print
Davef,
We have BGA (removed from PCBA).
We have Cleaned up the pads.
Instead of reballing can we directly mount on the Prime PCB like QFN.
Thanks
Martin
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=60332)
Date:
November 05, 2009 01:00 PM
Author:
SWAG
Subject: suggest whether we can place BGA without Bals on PCB after Print
The solder joints might hook up but my opinion is you'll end up with mechanically weak joints that could fail over time. If your trying to get your Xbox back on-line at home I'd try it but not if your charging $ to fix it for someone else or re-working something your selling.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=60335)
Date:
November 05, 2009 01:38 PM
Author:
davef
Subject: suggest whether we can place BGA without Bals on PCB after Print
Martin
It might be possible to mount a deballed BGA as you mount a QFN. Thinking about doing it, it could be a lot more difficult than first thought. When you heat a BGA, it 'dances' on the board because of the different CTE of the materials involved. All that dancing easily could make it impossible to maintain good solder contact between the pads on the board and the pads on the interposer.
Certainly, it will not be as reliable as a BGA with solder balls.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=60336)
