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As a start, consider running 'spell check' if you intend to keep the English portion.

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2.6.3 Test Pad Location Tolerances, third bullet. Why does Entek require different test point spacing than other surface finishes?

Page 55, top image is off the page, partially.

2.3.6 Depanelization of Arrays, 10th bullet [Breakaway Scoring] refers to "using a Lihr Hermann machine." What is this machine?

3.3.3 Thieving Pad Required for Wave Soldering Multi-leaded Devices, Table: "intersatitial" [2 places] should be "interstitial (staggered leads)"

3.4.6 SOICs [reflow]: Gives pads and pad layout for "wave" rather than reflow

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