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Lead Free Solder Paste Evaluation

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#58502

Lead Free Solder Paste Evaluation | 3 April, 2009

Looking for potential pastes to evaluate (success stories), and any and all paste evaluation procedures you may have used sucessfully to qualify a new product. Definition, slump, release, tack, voiding, reflow window, etc.

Thanks for any and all help.

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#58509

Lead Free Solder Paste Evaluation | 4 April, 2009

While you're waiting for others to replay, search the fine SMTnet Archives, here's an example: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=38918

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#58517

Lead Free Solder Paste Evaluation | 6 April, 2009

We are using Alpha's OM-338-PT with great results. The PT means pin testable which was selected because its residues are a little softer and clean slightly better.

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#58532

Lead Free Solder Paste Evaluation | 8 April, 2009

We have just switched to Almit (www.almit.com)LFM48 W TM-HP-S lead free solder paste.

In general terms it is an easy printing paste, with great slump properties, wide reflow process window and offers excellent solderability on all pcb / component pad surfaces.

We did not need to change our current reflow profile.

The paste is quite 'soft' so prints easily. We found it flows into apertures and out of them very well, but doesn't slump.

I've the UK contact name if you require it.

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#58545

Lead Free Solder Paste Evaluation | 8 April, 2009

When or before evaluating your paste you might want to find out how Readily available it is? From where it is coming to you? (Freight charges).. And how reliable the distributor is that is selling it to you. Nothing worse than running out of paste and finding out it's going to be a week to ten days for the next delivery. All that said I would suggest http://www.aimsolder.com

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#58547

Lead Free Solder Paste Evaluation | 8 April, 2009

I am looking to use a no clean and want to stick with SAC305 Steve, What would you recommend from Aim ?

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#58550

Lead Free Solder Paste Evaluation | 8 April, 2009

AIM has very narrow process window on their solder pastes...

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#58614

Lead Free Solder Paste Evaluation | 16 April, 2009

Sorry for the delay. We are actually pretty busy over here. We have found the Aim 257-2 no-clean sac305 paste offers very little if any voiding and better wetting in lead free terminated devices. My suggestion is contact your local Aim distributor for a sample or call them direct at 1-800-callaim. Best of luck

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#58621

Lead Free Solder Paste Evaluation | 17 April, 2009

I received my sample jar of NC257-2 SAC305 from Aim, and while that may have been true about older Aim paste formulations, this stuff prints and reflows better than anything I have tried and more importantly there were practically no voids on a 256 BGA that I had been having fits with.

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#58630

Lead Free Solder Paste Evaluation | 20 April, 2009

Have I ever lied to you in the past??? LOL Told you so!!

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#58639

Lead Free Solder Paste Evaluation | 22 April, 2009

Just to add a comment, we were using AIM Lead Free (SAC 305/ NC254 & 257) in the past and we had Voiding problems, then we tried Indium 8.9 HF, and we have better results, so now we are evaluating change to Indium for many of our products.

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#58642

Lead Free Solder Paste Evaluation | 22 April, 2009

I was using Indium 8.9 HF and AIM 257-2 was far superior in reducing voids. Just wait till you have a problem, if you have less than 10 lines running 24/7 don't expect a call back from Indium's Tech Support. It's been a couple weeks since we swithed and I couldn't be happier with the product or service. I am trying AIM flux and wire next week.

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#58643

Lead Free Solder Paste Evaluation | 22 April, 2009

We were using AIM WS485 SAC305 and AIM NC257 SAC305 and we had problems with voiding and AIM�s narrow process windows. Now we are using Indium3.2 and Indium8.9 with much better results.

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