With friends like you, who needs enemies?
I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potential reliability, and lack of reworkability problems of ENIG in some of your plants.
So, cozzin� up to those issues is a tough sell to your HASL users, eh?
Listen, who cares if you use more than one solderability protection on your boards? We run boards with every finish known to persons [must be PC, yano? orzit people? Whatever!!!] in our plant. We have several different profiles tailored to the board being processed on our reflow oven and wave solder machines. AND the surface finish has dip [er, close to dip] to do with the selection of a profile for a particular assembly.
I want to say the Merix has one of those nifty tables that compares the various surface finishes, but I can�t find their site. No BIGGIE. I imagine that Florida Cirtech, Hadco, and all the rest of those cats offer similar comparisons on their sites.
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