BGA Installation with IR unsolder

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would anybody guide me about soldering and unsoldering the B... - May 17, 2008 by azimi789

You should set the temperature at liquidus point of the sold... - May 19, 2008 by davef

I just set that as you said, but the component doesn't stick... - May 20, 2008 by azimi789

Did you get the solder to the temperature? Determine the tem... - May 21, 2008 by davef

I found out that the light is not heterogeneous, i am trying... - May 22, 2008 by azimi789

No, absolutely not. The BGA balls should collaps by theirse... - May 22, 2008 by Loco

azimi789

#54783

BGA Installation with IR unsolder | 17 May, 2008

would anybody guide me about soldering and unsoldering the BGA ic with Infrared unsolder dais please? in what range of temp. and time I should set the device? (ZORAN Quatrro 4110)

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davef

#54789

BGA Installation with IR unsolder | 19 May, 2008

You should set the temperature at liquidus point of the solder used on the BGA plus 20 to 25*C. So, for tin-lead that would be ~215*C. Most lead-free solders run about ~20 to 25*C higher than that.

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azimi789

#54810

BGA Installation with IR unsolder | 20 May, 2008

I just set that as you said, but the component doesn't stick on the board. I use AMTECh Flux type: RMA-223.. what should I do ?

Thanks.

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davef

#54837

BGA Installation with IR unsolder | 21 May, 2008

Did you get the solder to the temperature? Determine the temperature of the solder with a thermocouple.

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azimi789

#54839

BGA Installation with IR unsolder | 22 May, 2008

I found out that the light is not heterogeneous, i am trying to solve this problem... from my web surfing I encountered an article that claimed there should be 200 grams Placement Pressure on the BGA while soldering ... is that really needed? 200 grams is not so heavy?

Thanks

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Loco

#54840

BGA Installation with IR unsolder | 22 May, 2008

No, absolutely not. The BGA balls should collaps by theirselves. No external pressure should ever be applied.

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