HI, I have ran into this a time or two, and what I did before we got the BGA rework station was to run some flux under the component, and since the flux that was in the solder on the other solder joints has at least part of the way burned off in the original reflow, I would go ahead and apply (I used spray bottle) flux to the rest of the board, and then RE-reflow the board. This is not the greatest way to fix the problem, but if you are in a pinch It worked for me. as far as how to prevent the problem, the only thing I can think of is to look at the problem area of BGA prior to placement and make sure that there is no irregularity in Ball Diameter, then just make sure that your Paste looks perfect before placing, and before I would worry about it, I would take a look at the schematic for the board, alot of times there are un-used balls or common grounds and what not, that would make it where it really wouldn't matter(other then cosmetic) that there is a bridge. not really sure what you were looking for, Handling/fixing the bridge or handling/preventing the bridge. Good Luck, Wayne
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