Reflow Profiling Question

Hello All, I read AIMs article "Time Above Liquidus". It was very informative and a good read. One thing that the article didn't touch on, that is a mystery to me, is thermal shock to components during the ramp up stage of a profile. If you want to try and achieve 2-3 degrees/sec rampup rate sometimes you need a relatively high temperature at the onset of the profile. I notice on my profiles that a Zone1 temp of 150c will yield about 1-1.5 degrees/sec ramp up on most assemblies. Sometimes lower around .8. My question: 1. Is there a temperature that should not be exceeded at the onset of a profile due to risk of damaging components with thermal shock? 2. If I was running a tin/lead solder on a regular .6inch thick assembly and I have a Zone1 temp of 215c or higher to achieve 2-3degrees/sec on the largest component, would that possibly shock the smaller components on the assembly? When profiling I always gauge the profile from the largest/most critical component on the assembly. ie:BGAs, QFPs. Considering the thermal mass of these components is much higher than smaller components, the smaller components are going to be subject to much higher temps, for longer periods of time and at much higher slope rates. Do you guys/gals have any information/links on this issue? Thanks!!!!

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