About the optimum temperature of IC repair

Both questions will depend upon the IC specifications. Check the manufacturers recommendations for temperature specification, as well as reflow profiling.

As a general rule, we don't like to rework a component more than 2 times after initial reflow. Different customers have different general rules, however.

If components are being damaged by hot-air reworking, ensure that your operators are properly directing the hot-air at the leads of the device (other than BGA's) during rework. I've run into a situation here where my operators were reworking incorrectly, and allowing too much heat on to the body of the component, and not enough heat to reflow the leads. Didn't cause any damage, but I think that that is because we got lucky.

cheers ..rob

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Before we get too far down the road, tell us about the solder alloy you use.

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