Measuring the Z Axis on BGA Ball Heights

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We are looking for: 1. A company that sells inspection eq... - Jul 12, 2007 by reworkexchange

Bill 1 Systems for BGA, Flip Chip, CSP and Bump measurement... - Jul 12, 2007 by davef

reworkexchange

#51014

Measuring the Z Axis on BGA Ball Heights | 12 July, 2007

We are looking for:

1. A company that sells inspection equipment that can measure the height of solder balls (relative to the plane of the interposer or bottom of the device)

2. A service provider who can make some measurements for a user.

Any ideas?

Thanks!

BWET

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davef

#51020

Measuring the Z Axis on BGA Ball Heights | 12 July, 2007

Bill 1 Systems for BGA, Flip Chip, CSP and Bump measurement are: * UBM [550 Weddell Dr, Suite 3, Sunnyvale, CA 94089; 800-731-1220 f408-541-0153 contact@ubmusa.com ubmusa.com] ScanView, AutoScan and LaserScan. * Integrated Packaging Assembly; 2221 Old Oakland Rd. San Jose, CA 95131; 408-321-3600 F408-321-3660 ipac.com Jim Walker, marketing director * Semiconductor Products Group[Model 890 Automated Inspection System], View Engineering Division of General Scanning [1650 N. Voyager Ave, Simi Valley, CA 93063; 805-522-8439 genscan.com * RVSI; 5 Shawmut Rd, Canton, MA 02021; 800-669-5234 781-302-2439 F781-302-2440 rvsi.com Neal Sanders

2 Array package inspection service suppliers. * Equipment suppliers often offer such services. * Equipment suppliers often recommend customers that offer such services.

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