Baking of MSD devices

Hi! to all,

Here in our company, we sometimes received BGAs and ICs that were packed poorly(not sealed), and no MSL level written to it from our suppliers, now we subject the material for baking before using it. We use J-STD-033B table 4-1 as our criteria in baking the material. Now, after determining the body thickness of the BGA for example, what MSL level are we going to use to get the amount of time of baking? because on the table, there are 6 MSL levels to choose from, 2 ~ 5a.

Pls enlighten us on this..thanks

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