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05/22/13
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1 |
124 |
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05/22/13
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629 |
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05/22/13
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4 |
267 |
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05/21/13
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3 |
843 |
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05/21/13
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4 |
1212 |
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05/21/13
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1 |
110 |
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05/21/13
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2 |
74 |
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05/21/13
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1 |
110 |
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05/21/13
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1 |
41 |
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05/21/13
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6 |
485 |
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05/21/13
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9 |
1654 |
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05/21/13
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9 |
1754 |
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05/21/13
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4 |
404 |
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05/20/13
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4 |
811 |
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05/20/13
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2 |
191 |
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05/20/13
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5 |
339 |
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05/17/13
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1 |
115 |
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05/17/13
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412 |
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05/16/13
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2 |
1666 |
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05/16/13
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10 |
1741 |
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05/15/13
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1 |
653 |
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05/15/13
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2 |
215 |
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05/15/13
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1 |
210 |
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05/15/13
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1 |
119 |
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05/15/13
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7 |
1113 |
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05/15/13
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4 |
392 |
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05/15/13
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7 |
889 |
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05/15/13
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1 |
65 |
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05/14/13
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1 |
389 |
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05/14/13
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1 |
86 |
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05/14/13
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1 |
144 |
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05/13/13
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2 |
2451 |
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05/13/13
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11 |
863 |
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05/13/13
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3 |
1303 |
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05/10/13
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2 |
494 |
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05/10/13
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1 |
70 |
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05/09/13
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1 |
150 |
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05/09/13
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4 |
886 |
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05/09/13
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1 |
136 |
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05/09/13
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3 |
604 |
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05/09/13
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4 |
1155 |
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05/08/13
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9 |
1432 |
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05/08/13
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228 |
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05/08/13
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9 |
463 |
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05/08/13
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1 |
79 |
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05/07/13
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232 |
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05/07/13
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3 |
214 |
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05/06/13
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3 |
449 |
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05/04/13
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1 |
449 |
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05/03/13
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3 |
534 |
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05/02/13
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3 |
1411 |
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05/02/13
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5 |
2114 |
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05/02/13
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3 |
220 |
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05/02/13
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4 |
1749 |
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05/01/13
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1 |
865 |
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04/30/13
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5 |
1737 |
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04/30/13
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4 |
513 |
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04/29/13
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1 |
221 |
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04/29/13
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5 |
3612 |
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04/29/13
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2 |
482 |
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04/26/13
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3 |
763 |
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04/26/13
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4 |
757 |
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04/25/13
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10 |
5140 |
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04/25/13
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6 |
1225 |
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04/24/13
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4 |
1817 |
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04/24/13
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4 |
778 |
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04/24/13
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7 |
2038 |
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04/24/13
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8 |
1921 |
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04/23/13
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4 |
1098 |
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04/23/13
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2 |
325 |
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04/23/13
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3 |
416 |
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Company |
Author |
Updated |
Comments |
Views |
|
|---|---|---|---|---|---|
5/05/13 |
0 |
86 |
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5/01/13 |
0 |
119 |
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3/14/13 |
0 |
216 |
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2/26/13 |
0 |
300 |
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2/26/13 |
2 |
447 |
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2/25/13 |
0 |
295 |
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2/23/13 |
1 |
302 |
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2/14/13 |
0 |
262 |
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1/28/13 |
0 |
326 |
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1/27/13 |
0 |
306 |
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1/03/13 |
0 |
598 |
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1/03/13 |
0 |
553 |
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12/15/12 |
0 |
439 |
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Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering |
12/12/12 |
1 |
465 |
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10/26/12 |
0 |
439 |
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10/25/12 |
0 |
498 |
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10/25/12 |
0 |
416 |
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10/24/12 |
0 |
600 |
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10/23/12 |
0 |
358 |
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10/11/12 |
0 |
431 |
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9/05/12 |
0 |
640 |
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Top Ten Issues and Misconceptions Associated with MSD Control |
9/05/12 |
0 |
600 |
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8/30/12 |
4 |
689 |
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8/30/12 |
0 |
532 |
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8/21/12 |
0 |
589 |
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6/21/12 |
1 |
652 |
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Novel Probing Concepts for Mass-Production Tests: Design and Challenges |
6/13/12 |
0 |
634 |
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6/07/12 |
0 |
649 |
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6.5 Million LinkedIn Accounts May Be Compromised, Change Your Passwords Now |
6/06/12 |
0 |
574 |
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5/31/12 |
0 |
707 |
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5/23/12 |
0 |
665 |
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Environmental Compliance Reporting – Mastering a Moving Target |
5/16/12 |
0 |
594 |
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5/15/12 |
0 |
641 |
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5/09/12 |
0 |
803 |
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4/07/12 |
0 |
853 |
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3/30/12 |
0 |
826 |
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3/14/12 |
0 |
617 |
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3/09/12 |
0 |
639 |
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3/06/12 |
0 |
827 |
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3/06/12 |
3 |
906 |
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3/05/12 |
4 |
1111 |
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2/24/12 |
0 |
809 |
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2/22/12 |
0 |
864 |
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2/20/12 |
1 |
1216 |
SMTnet Talkback! |
Section |
Updated |
Comments |
Views |
|---|---|---|---|---|
Screen Printing Solutions for Small Die & Precision Alignment Challenges |
4/05/13 |
1 |
86 |
|
Count On Tools Reduces the Price on Replacement Pace Pre-Filters |
3/14/13 |
1 |
0 |
|
11/10/12 |
2 |
773 |
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10/31/12 |
2 |
1349 |
||
10/09/12 |
2 |
925 |
||
A Novel Material for High Layer Count and High Reliability Printed Circuit Boards |
10/03/12 |
2 |
661 |
|
Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment |
9/25/12 |
5 |
586 |
|
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints |
9/18/12 |
2 |
833 |
|
Pad Cratering - The Invisible Threat to the Electronics Industry |
9/11/12 |
6 |
1079 |
|
9/05/12 |
1 |
853 |
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Effects of Tin and Copper Nanotexturization on Tin Whisker Formation |
8/17/12 |
1 |
758 |
|
Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments |
8/13/12 |
7 |
1179 |