Printed Circuit Board Assembly & PCB Design Forum
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05/18/13
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05/18/13
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05/17/13
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05/16/13
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05/15/13
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05/15/13
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05/15/13
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05/15/13
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871 |
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05/15/13
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05/14/13
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05/14/13
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05/14/13
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05/14/13
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05/13/13
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2443 |
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05/13/13
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11 |
852 |
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05/13/13
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1298 |
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05/10/13
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488 |
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05/10/13
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67 |
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05/09/13
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405 |
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05/09/13
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145 |
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05/09/13
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877 |
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05/09/13
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05/09/13
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595 |
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05/09/13
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1146 |
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05/09/13
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142 |
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05/08/13
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9 |
1429 |
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05/08/13
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224 |
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05/08/13
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9 |
456 |
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05/08/13
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77 |
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05/07/13
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229 |
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05/07/13
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208 |
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05/06/13
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3 |
759 |
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05/06/13
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3 |
441 |
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05/04/13
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1 |
441 |
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05/03/13
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530 |
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05/02/13
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3 |
1408 |
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05/02/13
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2107 |
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05/02/13
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217 |
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05/02/13
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1743 |
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05/01/13
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1 |
857 |
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04/30/13
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5 |
1728 |
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04/30/13
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4 |
502 |
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04/29/13
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1 |
211 |
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04/29/13
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5 |
3606 |
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04/29/13
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479 |
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04/26/13
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761 |
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04/26/13
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4 |
754 |
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04/25/13
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5130 |
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04/25/13
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1220 |
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04/24/13
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1814 |
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04/24/13
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775 |
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04/24/13
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2034 |
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04/24/13
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8 |
1915 |
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04/23/13
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1089 |
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04/23/13
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2 |
321 |
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04/23/13
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3 |
412 |
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Company |
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5/05/13 |
0 |
74 |
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5/01/13 |
0 |
109 |
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3/14/13 |
0 |
213 |
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2/26/13 |
0 |
298 |
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2/26/13 |
2 |
440 |
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2/25/13 |
0 |
288 |
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2/23/13 |
1 |
289 |
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2/14/13 |
0 |
260 |
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1/28/13 |
0 |
324 |
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1/27/13 |
0 |
303 |
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1/03/13 |
0 |
594 |
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1/03/13 |
0 |
550 |
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12/15/12 |
0 |
431 |
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Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering |
12/12/12 |
1 |
459 |
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10/26/12 |
0 |
433 |
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10/25/12 |
0 |
492 |
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10/25/12 |
0 |
404 |
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10/24/12 |
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578 |
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10/23/12 |
0 |
354 |
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10/11/12 |
0 |
426 |
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9/05/12 |
0 |
635 |
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Top Ten Issues and Misconceptions Associated with MSD Control |
9/05/12 |
0 |
595 |
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8/30/12 |
4 |
680 |
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8/30/12 |
0 |
527 |
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8/21/12 |
0 |
585 |
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6/21/12 |
1 |
649 |
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Novel Probing Concepts for Mass-Production Tests: Design and Challenges |
6/13/12 |
0 |
629 |
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6/07/12 |
0 |
643 |
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6.5 Million LinkedIn Accounts May Be Compromised, Change Your Passwords Now |
6/06/12 |
0 |
571 |
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5/31/12 |
0 |
702 |
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5/23/12 |
0 |
660 |
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Environmental Compliance Reporting – Mastering a Moving Target |
5/16/12 |
0 |
589 |
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5/15/12 |
0 |
638 |
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5/09/12 |
0 |
797 |
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4/07/12 |
0 |
849 |
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3/30/12 |
0 |
823 |
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3/14/12 |
0 |
613 |
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3/09/12 |
0 |
635 |
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3/06/12 |
0 |
822 |
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3/06/12 |
3 |
902 |
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3/05/12 |
4 |
1103 |
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2/24/12 |
0 |
803 |
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2/22/12 |
0 |
860 |
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2/20/12 |
1 |
1212 |
SMTnet Talkback! |
Section |
Updated |
Comments |
Views |
|---|---|---|---|---|
Screen Printing Solutions for Small Die & Precision Alignment Challenges |
4/05/13 |
1 |
83 |
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Count On Tools Reduces the Price on Replacement Pace Pre-Filters |
3/14/13 |
1 |
0 |
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11/10/12 |
2 |
770 |
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10/31/12 |
2 |
1342 |
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10/09/12 |
2 |
922 |
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A Novel Material for High Layer Count and High Reliability Printed Circuit Boards |
10/03/12 |
2 |
658 |
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Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment |
9/25/12 |
5 |
581 |
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Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints |
9/18/12 |
2 |
829 |
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Pad Cratering - The Invisible Threat to the Electronics Industry |
9/11/12 |
6 |
1077 |
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9/05/12 |
1 |
850 |
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Effects of Tin and Copper Nanotexturization on Tin Whisker Formation |
8/17/12 |
1 |
756 |
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Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments |
8/13/12 |
7 |
1174 |
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