Printed Circuit Board Assembly & PCB Design Forum
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05/18/13
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05/17/13
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05/14/13
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05/13/13
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05/13/13
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05/13/13
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05/10/13
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05/10/13
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05/09/13
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05/09/13
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05/09/13
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05/08/13
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05/08/13
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05/08/13
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05/08/13
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05/07/13
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229 |
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05/07/13
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05/06/13
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05/06/13
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05/04/13
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05/03/13
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05/02/13
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05/02/13
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05/02/13
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05/02/13
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05/01/13
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04/30/13
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04/30/13
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500 |
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04/29/13
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207 |
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04/29/13
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3604 |
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04/29/13
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477 |
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04/26/13
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755 |
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04/26/13
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752 |
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04/25/13
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04/25/13
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04/24/13
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04/24/13
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04/24/13
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04/24/13
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1911 |
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04/23/13
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04/23/13
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316 |
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04/23/13
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408 |
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04/19/13
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1971 |
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04/19/13
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4 |
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Company |
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5/05/13 |
0 |
73 |
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5/01/13 |
0 |
106 |
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3/14/13 |
0 |
212 |
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2/26/13 |
0 |
297 |
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2/26/13 |
2 |
440 |
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2/25/13 |
0 |
286 |
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2/23/13 |
1 |
289 |
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2/14/13 |
0 |
259 |
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1/28/13 |
0 |
323 |
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1/27/13 |
0 |
302 |
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1/03/13 |
0 |
593 |
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1/03/13 |
0 |
548 |
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12/15/12 |
0 |
431 |
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Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering |
12/12/12 |
1 |
458 |
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10/26/12 |
0 |
433 |
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10/25/12 |
0 |
489 |
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10/25/12 |
0 |
403 |
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10/24/12 |
0 |
575 |
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10/23/12 |
0 |
354 |
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10/11/12 |
0 |
425 |
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9/05/12 |
0 |
634 |
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Top Ten Issues and Misconceptions Associated with MSD Control |
9/05/12 |
0 |
592 |
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8/30/12 |
4 |
677 |
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8/30/12 |
0 |
525 |
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8/21/12 |
0 |
584 |
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6/21/12 |
1 |
647 |
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Novel Probing Concepts for Mass-Production Tests: Design and Challenges |
6/13/12 |
0 |
626 |
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6/07/12 |
0 |
641 |
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6.5 Million LinkedIn Accounts May Be Compromised, Change Your Passwords Now |
6/06/12 |
0 |
568 |
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5/31/12 |
0 |
701 |
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5/23/12 |
0 |
659 |
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Environmental Compliance Reporting – Mastering a Moving Target |
5/16/12 |
0 |
587 |
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5/15/12 |
0 |
636 |
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5/09/12 |
0 |
794 |
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4/07/12 |
0 |
847 |
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3/30/12 |
0 |
822 |
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3/14/12 |
0 |
613 |
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3/09/12 |
0 |
635 |
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3/06/12 |
0 |
821 |
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3/06/12 |
3 |
901 |
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3/05/12 |
4 |
1103 |
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2/24/12 |
0 |
802 |
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2/22/12 |
0 |
860 |
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2/20/12 |
1 |
1210 |
SMTnet Talkback! |
Section |
Updated |
Comments |
Views |
|---|---|---|---|---|
Screen Printing Solutions for Small Die & Precision Alignment Challenges |
4/05/13 |
1 |
82 |
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Count On Tools Reduces the Price on Replacement Pace Pre-Filters |
3/14/13 |
1 |
0 |
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11/10/12 |
2 |
769 |
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10/31/12 |
2 |
1342 |
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10/09/12 |
2 |
920 |
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A Novel Material for High Layer Count and High Reliability Printed Circuit Boards |
10/03/12 |
2 |
655 |
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Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment |
9/25/12 |
5 |
581 |
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Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints |
9/18/12 |
2 |
828 |
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Pad Cratering - The Invisible Threat to the Electronics Industry |
9/11/12 |
6 |
1075 |
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9/05/12 |
1 |
848 |
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Effects of Tin and Copper Nanotexturization on Tin Whisker Formation |
8/17/12 |
1 |
755 |
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Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments |
8/13/12 |
7 |
1172 |
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