Printed Circuit Board Assembly & PCB Design Forum
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05/22/13
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11 |
1982 |
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Where can I purchase replacement rubber PCB carrier material? |
05/22/13
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05/22/13
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05/21/13
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05/20/13
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05/14/13
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05/14/13
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05/13/13
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05/13/13
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05/13/13
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05/10/13
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05/10/13
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05/09/13
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150 |
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05/09/13
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05/09/13
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05/09/13
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05/09/13
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05/08/13
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05/08/13
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05/07/13
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05/06/13
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05/04/13
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05/03/13
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05/02/13
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05/02/13
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05/02/13
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05/02/13
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05/01/13
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04/30/13
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04/30/13
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04/29/13
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04/29/13
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04/29/13
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04/26/13
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04/26/13
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04/25/13
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04/25/13
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04/24/13
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04/24/13
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04/24/13
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04/24/13
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5/05/13 |
0 |
88 |
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5/01/13 |
0 |
121 |
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3/14/13 |
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219 |
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2/26/13 |
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301 |
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2/26/13 |
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2/25/13 |
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2/14/13 |
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263 |
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1/28/13 |
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327 |
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1/27/13 |
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307 |
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1/03/13 |
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599 |
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1/03/13 |
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554 |
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12/15/12 |
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444 |
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Updated IPC-AJ-820A Provides Nitty-Gritty of Electronics Assembly and Soldering |
12/12/12 |
1 |
466 |
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10/26/12 |
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440 |
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10/25/12 |
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10/24/12 |
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10/23/12 |
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10/11/12 |
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432 |
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9/05/12 |
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641 |
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Top Ten Issues and Misconceptions Associated with MSD Control |
9/05/12 |
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601 |
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8/30/12 |
4 |
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8/30/12 |
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533 |
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8/21/12 |
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590 |
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6/21/12 |
1 |
654 |
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Novel Probing Concepts for Mass-Production Tests: Design and Challenges |
6/13/12 |
0 |
636 |
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6/07/12 |
0 |
650 |
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6.5 Million LinkedIn Accounts May Be Compromised, Change Your Passwords Now |
6/06/12 |
0 |
575 |
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5/31/12 |
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708 |
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5/23/12 |
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666 |
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Environmental Compliance Reporting – Mastering a Moving Target |
5/16/12 |
0 |
595 |
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5/15/12 |
0 |
642 |
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5/09/12 |
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804 |
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4/07/12 |
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854 |
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3/30/12 |
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828 |
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3/14/12 |
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618 |
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3/09/12 |
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640 |
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3/06/12 |
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3/06/12 |
3 |
908 |
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3/05/12 |
4 |
1112 |
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2/24/12 |
0 |
811 |
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2/22/12 |
0 |
865 |
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2/20/12 |
1 |
1217 |
SMTnet Talkback! |
Section |
Updated |
Comments |
Views |
|---|---|---|---|---|
Screen Printing Solutions for Small Die & Precision Alignment Challenges |
4/05/13 |
1 |
87 |
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Count On Tools Reduces the Price on Replacement Pace Pre-Filters |
3/14/13 |
1 |
0 |
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11/10/12 |
2 |
773 |
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10/31/12 |
2 |
1349 |
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10/09/12 |
2 |
926 |
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A Novel Material for High Layer Count and High Reliability Printed Circuit Boards |
10/03/12 |
2 |
661 |
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Evaluation of Laminates in Pb-free HASL Process and Pb-free Assembly Environment |
9/25/12 |
5 |
589 |
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Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints |
9/18/12 |
2 |
833 |
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Pad Cratering - The Invisible Threat to the Electronics Industry |
9/11/12 |
6 |
1080 |
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9/05/12 |
1 |
853 |
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Effects of Tin and Copper Nanotexturization on Tin Whisker Formation |
8/17/12 |
1 |
758 |
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Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments |
8/13/12 |
7 |
1179 |
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