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New to ROHS

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New to ROHS - Dec 15, 2006 by John_Foster  

New to ROHS - Dec 15, 2006 by Real Chunks  

New to ROHS - Dec 15, 2006 by

New to ROHS - Dec 15, 2006 by RDR  

New to ROHS - Dec 18, 2006 by John_Foster  

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#46190

New to ROHS | 15 December, 2006

Hello I am a circuit board designer and just wanted to ask
if anyone is seeing the need to alter footprints for ROHS
assembly.
I also wanted to make sure that I have this particular issue correct.
If your BGA is lead free then used solder paste with lead
could lead to voids. I know there is some issue with BGA's
and was just hoping to get some clarification.
Thanks in advance for any response

John

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#46194

New to ROHS | 15 December, 2006

So far after a year, NO. No need to alter footprints.

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MFG CAVEMAN

#46198

New to ROHS | 15 December, 2006

John,

Search the archives for lead free BGA and you should find plenty of info.

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RDR

#46199

New to ROHS | 15 December, 2006

we have has to alter some footprints to facilitate component rework/removal.

We have some assemlies that have 2 oz and heavier copper, these boards require a lrger tip to melt solder so we have had to extend pads to allow the larger tips to touch pad being worked on.

Voids happen in all lead bgas as well, the issue is the non homogenous solder joint when thew alloys are mixed.

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#46232

New to ROHS | 18 December, 2006

Thank you for the respones.

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