Conference: Main Conference
Forum: SMT Production & Design
Thread: Reflow Profile Design

Date: June 15, 2007 11:34 AM
Author: cman
Subject: Reflow Profile Design

What is the board finish? Did you profile built assy and get the temps on the board with a t/c in the board? DId you drill the BGA and get the t/c at the ball? When the parts came off the board did all of hte solder come off the pads and stay with the part? Did the BGA ball colaps? Is this a ROHS appliction? if not is the part ROHS.


(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=50685)