Forum: SMT Production & Design
Thread: BGA Reflow
Date: June 15, 2011 01:08 PM
Author: Hegemon
Subject: BGA Reflow
Check your reflow profile as well, it could be that your ramp rate from flux activation to reflow might be too steep. This is in the same line as the post from Ken. Too fast a rise in temperature will collapse the outside rows too far in advance of the inner rows, leading to that kind of corner defect.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=64495)