Forum: SMT Production & Design
Thread: Lead-Free BGA Rework
Date: June 30, 2007 06:54 AM
Author: gramsey
Subject: Lead-Free BGA Rework
I have encountered poorly designed BGA packages that cannot be removed or replaced with BGA rework tools. I discussed this with the package designer. He recommended reflowing the entire board.
I was finally able to remove the part by preheating the board to near reflow temp then bumping the part with IR. Replacing the part in a reflow oven.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=50908)