Forum: SMT Production & Design
Thread: How many times can a component go through reflow oven?
Date: August 21, 2009 04:37 AM
Author: Graham Cooper
Subject: How many times can a component go through reflow oven?
Manufacturers of non hermetic SMT components have to test their devices as per IPC JEDEC 20C to check their reflow and moisture sensitivity. In this spec they pass them through reflow 3 times, then check them for damage and retest their performance. Providing you store your non hermetic components as per IPC JEDEC 33 before assembly and they don't go over their open floor time between reflow profiles then they should be okay for 3 passes. 4 passes is probably unknown territory but the device manufacturers should be able to advise.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=59589)