Forum: SMT Production & Design
Thread: Nitrogen gas and Tombstone defect
Date: November 29, 2011 02:55 PM
Author: josh
Subject: Nitrogen gas and Tombstone defect
N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soak thus improving wetting etc. Having access to it on your oven is a handy tool if available for certain assemblies.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=65552)