So far after ~1500 units printed with the stencil treated once with Rain-X, no issues were detected with solder joints. The only difference is no more solder bridges on fine pitch with .010" openings. The print is picture perfect on all pads, nice and even, flat across the top.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=64681)