If the goal is selective soldering (not to raise the substrate temperature too high), consider the use of microwaves. Our company has been working on this technology for selectively bonding substrates. For example, we use the process to bond ROHS metallizations bumps at far lower temps than what's applied in the industry.
(http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_ID=52719)