Mar 12, 2018 
ITASCA, IL — March 12, 2018
Contact: Michelle O’Brien, Marketing & Communications Specialist
Kester is proud to announce the launch of NP560, a no-clean, lead-free, halogen-free solder paste. It consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. In addition to its stable, consistent product performance, NP560 has redefined the voiding standard for PCB assembly and has the potential for low voiding performance.
For additional information on this product including technical and safety data sheets, please visit https://www.kester.com/products/product/np560-solder-paste.
For any questions or additional information, please contact: Fil Marcial-Hatfield, Global Product Manager at fmarcial@kester.com.
