SUPPLIER: Qinyi Electronics Co.,Ltd

Panasonic NPM W2 pick and place machine

Model:	Panasonic NPM W2 pick and place machine
Category:	Pick and Place/Feeders
Model Year:	2022
Condition:	new
Location:	Guangdong, China
Offered by:	Qinyi Electronics Co.,Ltd
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FEATURES

▶Higher productivity and quality with printing, placement and inspection process integration
▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm
▶Higher area productivity through dual lane placement
▶Quick-change feeder carts and nozzle banks
▶Lightweight 16-nozzle head (for 77,000 CPH) with increased placement accuracy to 25um (cpk ≥ 1.0)

Model ID	NPM-W2
Rear head Front head	Lightweight 16-nozzle head	12-nozzle head	Lightweight 8-nozzle head	3-nozzle head V2	Dispensing head	No head
Lightweight 16-nozzle head	NM-EJM7D				NM-EJM7D-MD	NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head	NM-EJM7D-MD				-	NM-EJM7D-D
Inspection head	NM-EJM7D-MA				-	NM-EJM7D-A
No head	NM-EJM7D				NM-EJM7D-D	-

PCB dimensions (mm)	Single-lane^*1	Batch mounting	L 50 x W 50 ~ L 750 x W 550
		2-positin mounting	L 50 x W 50 ~ L 350 x W 550
	Dual-lane^*1	Dual transfer (Batch)	L 50 × W 50 ~ L 750 × W 260
		Dual transfer (2-positin)	L 50 × W 50 ~ L 350 × W 260
		Single transfer (Batch)	L 50 × W 50 ~ L 750 × W 510
		Single transfer (2-positin)	L 50 × W 50 ~ L 350 × W 510
Electric source			3-phase AC 200, 220, 380, 400, 420, 480 V 2.8 kVA
Pneumatic source ^*2			0.5 MPa, 200 L /min (A.N.R.)
Dimensions ^*2(mm)			W 1 280^3 × D 2 332 ^4 × H 1 444 ^*5
Mass			2 470 kg (Only for main body : This differs depending on the option configuration.)

Placement head		Lightweight 16-nozzle head (Per head)		12-nozzle head (Per head)		Lightweight 8-nozzle head (Per head)	3-nozzle head V2 (Per head)
		High production mode [ON]	High production mode [OFF]	High production mode [ON]	High production mode [OFF]
Max. speed		38 500cph (0.094 s/ chip)	35 000cph (0.103 s/ chip)	32 250cph (0.112 s/ chip)	31 250cph (0.115 s/ chip)	20 800cph (0.173 s/ chip)	8 320cph (0.433 s/ chip) 6 500cph (0.554 s/ QFP)
Placement accuracy (Cpk1)		±40 μm / chip	±30 μm / chip (±25μm / chip)^*6	±40 μm / chip	±30 μm / chip	± 30 µm/chip ± 30 µm/QFP 12mm to 32mm ± 50 µm/QFP 12mm Under	± 30 µm/QFP
Component dimensions (mm)		0402^*7 chip ~ L 6 x W 6 x T 3	03015^{7 8}/0402^*7 chip ~ L 6 x W 6 x T 3	0402^*7 chip ~ L 12 x W 12 x T 6.5		0402^*7 chip ~ L 32 x W 32 x T 12	0603 chip to L 150 x W 25 (diagonal152) x T 30
Component supply	Taping	Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm				Tape : 4 to 56 mm	Tape : 4 to 56 / 72 / 88 / 104 mm
		Max.120 (Tape: 4, 8 mm)				Front/rear feeder cart specifications : Max.120 ( Tape width and feeder are subject to the conditions on the left) Single tray specifications : Max.86 ( Tape width and feeder are subject to the conditions on the left) Twin tray specifications : Max.60 ( Tape width and feeder are subject to the conditions on the left)
	Stick	-				Front/rear feeder cart specifications : Max.30 (Single stick feeder) Single tray specifications : Max.21 (Single stick feeder) Twin tray specifications : Max.15 (Single stick feeder)
	Tray	-				Single tray specifications : Max.20 Twin tray specifications : Max.40

Dispensing head	Dot dispensing	Draw dispensing
Dispensing speed	0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)	4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)^*9
Adhesive position accuracy (Cpk1)	± 75 μ m /dot	± 100 μ m /component
Applicable components	1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP	BGA, CSP

Inspection head		2D inspection head (A)	2D inspection head (B)
Resolution		18 µm	9 µm
View size (mm)		44.4 x 37.2	21.1 x 17.6
Inspection processing time	Solder Inspection ^*10	0.35s/ View size
	Component Inspection ^*10	0.5s/ View size
Inspection object	Solder Inspection ^*10	Chip component : 100 μm × 150 μm or more (0603 or more) Package component : φ150 μm or more	Chip component : 80 μm × 120 μm or more (0402 or more) Package component : φ120 μm or more
	Component Inspection ^*10	Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector^*11	Square chip (0402 or more), SOP, QFP (a pitch of 0.3mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector^*11
Inspection items	Solder Inspection ^*10	Oozing, blur, misalignment, abnormal shape, bridging
	Component Inspection ^*10	Missing, shift, flipping, polarity, foreign object inspection ^*12
Inspection position accuracy ^*13 ( Cpk1)		± 20 μm	± 10 μm
No. of inspection	Solder Inspection ^*10	Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
	Component Inspection ^*10	Max. 10 000 pcs./machine

*1	:	Please consult us separately should you connect it to NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
*2	:	Only for main body
*3	:	1 880 mm in width if extension conveyors (300 mm) are placed on both sides.
*4	:	Dimension D including tray feeder : 2 570 mm Dimension D including feeder cart : 2 465 mm
*5	:	Excluding the monitor, signal tower and ceiling fan cover.
*6	:	±25 μm placement support option.(Under conditions specified by PSFS)
*7	:	The 03015/0402 chip requires a specific nozzle/feeder.
*8	:	Support for 03015 mm chip placement is optional. (Under conditions specified by PSFS:Placement accuracy ±30 μm / chip)
*9	:	A PCB height measurement time of 0.5s is included.
*10	:	One head cannot handle solder inspection and component inspection at the same time.
*11	:	Please refer to the specification booklet for details.
*12	:	Foreign object is available to chip components.(Excluding 03015 mm chip)
*13	:	This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

*Placement tact time,inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.

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Company Information:

Focusing on the SMT field for more than 15 years, QYSMT has been committed to meeting the needs of customers and partners. Our mission is to provide the best solutions while helping to reduce costs and increase efficiency.

Shenzhen, Guangdong, China

Equipment Dealer / Broker / Auctions, Manufacturer

QYSMT / MOREL USA CONTACT – SUSANTA TRIPATHY.: 1-912-373-4005 / China Contact: 86-075521635007

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