Automatic High Precision Die Bonder AD280Plus

Model:	Automatic High Precision Die Bonder AD280Plus
Category:	Semiconductor & Solar
Model Year:	2022
Condition:	new
Location:	China
Offered by:	SHENZHEN TOPQUALITY INDUSTRY & EQUIPMENT LTD.,
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AD280Plus, an Automatic High Precision Die Bonder that achieves ± 3 µm @ 3σ XY placement accuracy with patented pattern recognition. It offers flip chip handling and diverse material compatibility, including wafer, waffle pack, Gel-Pak, tray, tape feeder, or custom options. Enhancing traceability, it incorporates barcode, 2D code, or OCR technology on substrates, wafers, and dies. AD280Plus sets a new standard for precision, versatility, and traceability in die bonding technology.