Effect on Microwave Plasma Surface Treatment for Improved Adhesion Strenght of Direct Copper Plating on Polytetrafluoroethylene (PTFE)
Published: |
January 7, 2016 |
Author: |
Akira Takeuchi, Takahiro Kurahashi, Kyosuke Takeda |
Abstract: |
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and electroless copper plating. PTFE is widely used in many industries because of its unique electrical, thermal, and mechanical characteristics. However, because of its low surface energy, it is difficult to acquire enough adhesion strength between PTFE and other substances without surface modification. Plasma is well known as one of the surface modification techniques that improve adhesion strength.... |
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Effect on Microwave Plasma Surface Treatment for Improved Adhesion Strenght of Direct Copper Plating on Polytetrafluoroethylene (PTFE) article has been viewed 730 times
