Pillarhouse Orissa Synchrodex Pro

Pillarhouse Orissa Synchrodex Pro Description:

Enhanced, flexible, in-line, modular selective soldering system

Designed as a modular system, the Synchrodex Pro range of in-line equipment offers the ultimate in flexibility with the ability to upgrade to high-speed throughput when multiple modules are placed together.

The standard Synchrodex Pro solder module is supplied with an on-board Drop-Jet flux head and offers top side and bottom side slide in/out infra-red pre-heat linked to closed-loop pyrometer control. Pillarhouse can also configure any of our frame sizes to operate as dedicated fluxing and/or I.R./convection heating modules, which, when placed in-line with solder module(s), will significantly increase production throughput.

Our 1600mm solder module offers the ability to process PCBs using either a single or dual-bath operating format. Single bath operation allows for an alternate nozzle process on a single 610mm x 610mm PCB. Dual-bath operation allows for a dual-board, simultaneous, independent nozzle process for increased soldering flexibility on 420mm x 610mm PCBs. Pillarhouse’s uniquely flexible approach is facilitated via a software controlled, mechanical three pin stop arrangement on the conveyor section allowing for either single or dual PCB management.

Our largest PCB handling capability of 1143mm x 610mm can be achieved when using the XL frame size.

The Synchrodex Pro can be configured with any of the currently available Pillarhouse solder technologies, including single point AP-1, patented 1.5mm micronozzle, Jet-Wave and custom multi-dip. Easy, rapid non-contact solder pot changeover is facilitated via the optional heated pot exchange trolley.

The Synchrodex Pro is controlled by a PC through our next generation PillarCOMM.NET, a Windows® based ‘Point & Click’ interface with PCB image display. Additionally, PillarCOMM.NET has an offline package that allows the operator to produce programs independently from the machine using Gerber data.

Standard Features

• Up to  1140mm x 610mm (45” x 24”) board handling with 610mm x 610mm (24″ x 24″) as standard
• Interchangeable Mechanical or Magnetic solder bath and pump
• Lead-free solder capability
• Inerted Nitrogen system
• Set of AP style solder nozzle tips
• Automatic nozzle conditioning system
• Thermal nozzle calibration
• Solder level detect and motorised wire feeder
• Wave height correction
• DC drives on all axes
• Colour programming camera
• Automatic fiducial correction
• Drop Jet fluxer
• Internal fume extraction
• Integral PC and monitor
• New PillarCOMM control software
• Multiple level password protection
• IPC-2591 (CFX), Smart Factory ready