VIGON® UC 160

Company Information:

The globally leading provider of high precision cleaning products, services and training solutions in the electronics and semiconductor manufacturing industries.

Manassas, Virginia, USA

Consultant / Service Provider, Manufacturer, Training Provider

(703) 393-9880
(703) 393-8618

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Company Postings:

(17) products in the catalog

(11) technical library articles

(482) news releases

Name:	VIGON® UC 160
Category:	Cleaning Agents
Offered by:	ZESTRON Americas

VIGON® UC 160 Description:

Water-based cleaning agent for SMT stencil printer underside wipe systems

VIGON® UC 160 based on MPC® Technology, is a water-based cleaning agent designed to effectively remove solder paste residues from fine pitch stencil apertures in SMT printers. With low evaporative losses and effective wettability, product consumption is minimized and wipe cycles are reduced for optimal line operation.

Advantages compared to other cleaners:

Ideal for cleaning leaded and lead free solder paste from fine pitch stencil apertures during stencil underside wipe applications
Due to its water-based formulation, this cleaning agent evaporates significantly more slowly than IPA, limiting evaporative losses
No flash point and evaporates residue free
Aqueous-based, surfactant-free cleaner with excellent material compatibility on all wetted parts (stencils & printers)
No scaling or residue build up
Halogen free
Low odor

VIGON® UC 160 was added in Apr 2022

VIGON® UC 160 has been viewed 190 times