Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


MPM Momentum

Views: 3666

#89464

MPM Momentum | 1 June, 2023

Good day to all, the question is, has anyone used stepped down profile in separation, and if so, for what purposes?

Attachments:

reply »

#89717

MPM Momentum | 17 July, 2023

Yes I have used it on multiple occasions. The purpose is to potentially help paste release from the stencil.

reply »

#89725

MPM Momentum | 18 July, 2023

The goal is clear, the question is in which case the use of "stepped down" is preferable to "continues"?

reply »

#89726

MPM Momentum | 18 July, 2023

As I said, the intent of the "stepped" feature is to aid in paste release. Continuous is normal mode. I believe the manual explains these features in depth.

reply »

#89749

MPM Momentum | 21 July, 2023

The purpose is explained in the program 'help' - 'contents' menu. Due to viscosity and adhesion of different fluxes, paste may stick to the stencil more than the board. Using steps allows the surface tension and gravity to pull the paste down; rather than the faster 'standard' separation which may tear the paste away before it can settle on the pads.

reply »

#89752

MPM Momentum | 21 July, 2023

Tanks everyone ,I will take yours advices into account. If there are working profiles for part 0201 & 01005, I will bi glad to get look at them. my e-mail: dima_ma@usr.co.il

reply »

SMT feeders

pressure curing ovens