MLC reflow using high temp Sn10Pb90 solder balls

Subscribe to Thread

I am considering using high-temp ball Sn10Pb90 + eutectic so... - Nov 08, 2012 by BryanNg

High-temp ball Sn10Pb90 + eutectic solder paste is common pl... - Nov 12, 2012 by davef

BryanNg

#67609

MLC reflow using high temp Sn10Pb90 solder balls | 8 November, 2012

I am considering using high-temp ball Sn10Pb90 + eutectic solder paste for MLC reflow (no underfill). You can see that there is no Intermetallic bond for the paste and the balls. Under high stress/shock condition, the solder joints develop micro cracks. Besides using LF balls + paste, could you recommend a metallurgy solution for MLC reflow?

reply »

davef

#67624

MLC reflow using high temp Sn10Pb90 solder balls | 12 November, 2012

High-temp ball Sn10Pb90 + eutectic solder paste is common place for MLC reflow. Temperatures necessary to alloy the high-temp ball Sn10Pb90 and eutectic solder would be high enough to compromise interposer, board and many components.

What are your: * High stress/shock conditions? * Eutectic solder alloy? * Process conditions?

reply »