You might find a lot of experience in the forum here, but maybe not so many consultants for this niche.
BGA underfill is not rocket science, and in my opinion, the key items are the material chracteristics, and the dispensing method and pattern.
For an example: A particular underfill material is dispensed with the PCB surface temperature maintained at 80C. At that temperature, the material stays thin, and will be pulled beneath the BGA by capillary action. The trick is in dispensing a line on two consecutive sides of the BGA, and replenishing those 2 lines as the material is pulled beneath the BGA, without allowing any air to be pulled in as well.
Truly, unless you are working with automated dispensing, this is more of a trial and error until you find the correct material, use the correct associated temperatures, dispensing timing, needle diameter.
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